কোরিয়ানএ 갈륨비소칩 এর মানে কি?
কোরিয়ান এর অভিধানে «갈륨비소칩» এর
আসল সংজ্ঞা দেখুন এ ক্লিক করুন।
বাংলাএ সংজ্ঞার
স্বয়ংক্রিয় অনুবাদ দেখুন এ ক্লিক করুন
কোরিয়ানএর অভিধানে 갈륨비소칩 এর সংজ্ঞা
গ্যালিয়াম আর্সেনিড চিপ এটি সিলিকন সেমিকন্ডাক্টরগুলির সীমাবদ্ধতা অতিক্রম করে একটি যৌগ সেমিকন্ডাক্টর যা গ্যালিয়াম আর্সেনাইড ব্যবহার করে একটি অর্ধপরিবাহী চিপ। 갈륨비소칩
실리콘 반도체가 가지는 한계를 극복한 것으로서 화합물 반도체인 갈륨비소를 사용한 반도체 칩이다.
কোরিয়ান এর অভিধানে «갈륨비소칩» এর
আসল সংজ্ঞা দেখুন এ ক্লিক করুন।
বাংলাএ সংজ্ঞার
স্বয়ংক্রিয় অনুবাদ দেখুন এ ক্লিক করুন
«갈륨비소칩» এর সঙ্গে সম্পর্কিত কোরিয়ান বই
নিম্নলিখিত গ্রন্থপঞ্জী নির্বাচনে
갈륨비소칩 শব্দটির ব্যবহার খুঁজুন। কোরিয়ান সাহিত্যে
갈륨비소칩 শব্দের ব্যবহারের প্রসঙ্গ সম্পর্কিত বই এবং তার থেকে সংক্ষিপ্তসার।
수 있 비해 상 당히 SE-7에 볼 것은 위해 개별 소자 또는 칩을 여러 개 연결한 하이브리드 형태로 구 성되어 그 응용기 술 진행 것에 중이었 업그레이드 작업이 한창 갈륨비소 기반의 전력증폭기인 분명했다. 대역을 포함한다양한 주파수 대역의 MMIC와 ...
2
GaAs MMIC Reliability - High Temperature Behavior - 111페이지
5.4.1 General Mathematical Assumptions and Model The "heat sources" on the GaAs chip are located in a very thin layer at the top surface of the GaAs chip. This thin layer, about 1⁄2 micron thick, is highly doped GaAs which has a slightly ...
Aris Christou, Willie M. Webb, 2006
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The goal for a GaAs microprocessor is a chip of no more than 10,000 FETs, a 200-MHz clock rate, and a 100 to 200 MIPS. One of the major differences between CMOS or NMOS silicon technology and E-MESFET GaAs technology is the ratio ...
C. Y. Chang, Francis Kai, 1994
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Micro- and Opto-Electronic Materials and Structures: ... - 494페이지
The influence of the bow in the substrate and in the chip is not considered in these calculations. (b) Corresponding normal stresses in the GaAs die. The normal stress in the GaAs die soldered on a Copper substrate exceeds the GaAs strength ...
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GaAs Devices and Circuits - 414페이지
Chip carrier moi PadMtal GaAs FET [30]. 3 mm and the peak temperature of 85°C corresponded to the thermal resistanc 10°C/W ($ = 57°Cmm/W) [35]. Experimental data agree within 10% -20% ' the results of the numerical simulation.
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Control Components Using Si, GaAs, and GaN Technologies:
Table 4.3 Summary of S/C-band MMIC Broadband Multibit Phase Shifters Freq. Range No. of Insertion Chip Size (GHz) Bits Loss (dB) (mm2) Technology Year [Reference] 2.0–8.0 2 6 8.1* 0.5-μm GaAs FET 1984 [32] 2.0–6.0 5 10 66.1* 0.5-μm ...
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Gallium Nitride Electronics - 287페이지
Following an impressive roadmap, GaAs device performance is still improving today and chip size is still continuously reduced, e.g., [6.49]. State-of-the-art GaAs microstrip PHEMT MMICs provide output power levels above 40dBm [6.12] and ...
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GaAs Microelectronics: VLSI Electronics Microstructure Science
PACKAGING AND INTERCONNECT TECHNOLOGY ISSUES FOR HIGH-FREQUENCY GaAs DIGITAL INTEGRATED CIRCUITS As noted earlier, the evolution of VLSI and VHSIC technology has emphasized the high on-chip device counts ...
Norman G. Einspruch, William R. Wisseman, 2014
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Reliability of Compound Analogue Semiconductor Integrated ...
A MMIC GaAs package consists typically of a thin square or rectangular GaAs chip approximately 100 × 100 mils, the package case, and the attachment material which bond the chip to the case. In some situations, there may be an ...
Aris Christou, Willie M. Webb, 2006
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Handbook of VLSI Chip Design and Expert Systems - 17페이지
A. F. Schwarz. b. CMOS inverters have a nearly ideal DC transfer characteristic. CMOS noise immunity is very much better than those of other technologies. c. The above properties are valid for a wide operating range of power supply voltages, ...
