MOTS EN ANGLAIS EN RAPPORT AVEC «PLANAR PROCESS»
planar process
planar
process
manufacturing
used
semiconductor
industry
build
individual
components
transistor
turn
connect
those
transistors
together
primary
which
modern
integrated
circuits
built
developed
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invention
computer
history
museum
develops
solve
reliability
problems
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thereby
revolutionizing
nobelprize
christophe
lécuyer
relied
heavily
masking
passivating
properties
encyclopedia
fractional
micrometer
thick
layer
grown
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diffusion
answers
plnr
prss
engineering
ieee
milestone
honors
rather
innovations
because
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creation
define
method
producing
diffused
junctions
devices
pattern
holes
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into
formed
chip
collection
state
transcription
page
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10 LIVRES EN ANGLAIS EN RAPPORT AVEC «PLANAR PROCESS»
Découvrez l'usage de
planar process dans la sélection bibliographique suivante. Des livres en rapport avec
planar process et de courts extraits de ceux-ci pour replacer dans son contexte son utilisation littéraire.
1
The Geek Atlas: 128 Places Where Science and Technology Come ...
And it was at Fairchild that the planar process for silicon chip manufacturing was
invented. Around the same time, in 1958/1959, Jack Kilby (atTexas Instruments)
and Robert Noyce (at Fairchild) invented the integrated circuit,where multiple ...
John Graham-Cumming, 2009
2
ELECTRONIC DEVICES AND APPLICATIONS
The planar process is comparatively inexpensive and produces good-quality
devices at cheaper prices. 4. Devices produced through planar process have
closely matching properties. 5. Doping levels can be precisely controlled. 6. All
types of ...
3
To the Digital Age: Research Labs, Start-up Companies, and ...
The Broader Community and the Benevolent Despotism of the Planar Process
The explosive growth in MOS papers after 1962 can be attributed to the
development of the planar process, the rise of the integrated circuit, and the
accompanying ...
4
Op Amp Applications Handbook
However, the important distinction in terms of device protection is that within the
planar process the otherwise exposed regions are left covered with silicon
dioxide. This feature reduced the device sensitivity to contaminants; making a
much ...
5
Data Conversion Handbook
However, the important distinction in terms of device protection is that within the
planar process the otherwise exposed regions are left covered with silicon
dioxide. This feature reduced the device sensitivity to contaminants; making a
much ...
Analog Devices Inc., Engineeri, 2004
6
Makers of the Microchip: A Documentary History of Fairchild ...
The announcements attracted considerable attention in the electronics industry,
and the planar process was soon viewed as a major innovation that would
reorient the technological direction for the semiconductor industry. In order to
take part ...
Lécuyer, Christophe, Brock, David C.
7
The Semiconductor Business: The Economics of Rapid Growth ...
The integrated circuit period covers the years between the introduction of the
planar process and the integrated circuit (1959-61) and the introduction of the
microprocessor (1971). The chapter is organized in the following way: a
discussion of ...
8
Data Conversion Handbook
However, the important distinction in terms of device protection is that within the
planar process the otherwise exposed regions are left covered with silicon
dioxide. This feature reduced the device sensitivity to contaminants; making a
much ...
Walter Allan Kester, 2005
9
The Integrated Circuit Hobbyist's Handbook
Most ICs are still manufactured using the planar process which Noyce developed
in 1959. In the planar process, the various integrated compo- nents extend below
the surface of the substrate. Figure 1-1 CHAPTER ONE: Experimenting with ...
10
ULSI
Process Integration III: Proceedings of the ...
This attribute of silicon facilitated its utilization in the planar process as a diffusion
mask for p-n junction fabrication as developed by Frosch and Derrick [9,10], the
fabrication of the planar silicon transistor by Hoerni [12-15], passivation of the ...
Cor L. Claeys, Electrochemical Society. Electronics Division, 2003
10 ACTUALITÉS CONTENANT LE TERME «PLANAR PROCESS»
Découvrez de quoi on parle dans les médias nationaux et internationaux et comment le terme
planar process est employé dans le contexte des actualités suivantes.
Moore's Law in Transition
... can produce chips that deliver better performance and lower power than the commonly-used 28nm planar process at a comparable cost (and ... «PC Magazine, juil 15»
This is what the Huawei Mate 8 might look like
To deal with today's most powerful mobile chips' power consumption you need manufacture it with expensive 20nm planar process or even ... «Phone Arena, juil 15»
1k Qubit IC Has 128k Josephson Junctions
D-Wave Systems has put 1000 qubits, comprising 128,000 Josephson Junctions, on a chip using a 6-metal layer planar process with 0.25μm ... «ElectronicsWeekly.com, juin 15»
Dwave commercializes 1152 qubit chip but there are 2048 physical …
... over 128,000 Josephson junctions (tunnel junctions with superconducting electrodes) in a 6-metal layer planar process with 0.25μm features, ... «Next Big Future, juin 15»
UMC skips 20nm planar process tech, leaps ahead to 16nm FinFET
United Microelectronics Corp., the world's second largest contract maker of semiconductors, said that it would not offer 20nm planar fabrication ... «KitGuru, avril 15»
How Sony's Just-Announced Xperia Z4 Compares To The Xperia Z3
... the Snapdragon 810 continues to be built on TSMC's 20nm planar process technology. This gives Samsung's chip an advantage in thermal ... «Tom's Hardware, avril 15»
When Will AMD's Technology Process Catch Up To Intel's?
... customers as of earlier this month, and TSMC debuted its 20nm planar process back in September with Apple's (NASDAQ:AAPL) iPhone 6. «Seeking Alpha, avril 15»
Beneath the Surface 3: Intel's 14nm Atom Cherry Trail chip
Like the Snapdragon 810, the Apple A8 (iPhone 6 and iPhone 6 Plus) and A8X (iPad Air 2) are made by TSMC on its 20nm planar process. «ZDNet, avril 15»
Intel / Micron Announce 3D NAND Production with Industry's Highest …
... write speeds, and long term data retention in the TLC memory cells as the planar cell size was reduced in the newer planar process nodes. «PC Perspectives, mars 15»
48-layer V-NAND from Toshiba
... a 128TLC device on a 32-layer stack, which is the same density as it's getting on its best part on a planar process (19nm) at no better cost. «ElectronicsWeekly.com, mars 15»
