与 «METALLIZATION»相关的英语书籍
在以下的参考文献中发现
metallization的用法。与
metallization相关的书籍以及同一来源的简短摘要提供其在 英语文献中的使用情境。
1
Metallization: theory and practice for VLSI and ULSI
This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes.
2
Metallization of Polymers 2
As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more ...
3
Silver
Metallization: Stability and Reliability
It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization.
Daniel Adams, Terry L. Alford, James W. Mayer, 2007
4
VLSI
metallization: physics and technologies
This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications.
5
On State Stability in Programmable
Metallization Cell (PMC) ...
This work focuses on analyzing the reliability of different low resistance states in PMC devices under normal operating conditions and under extreme stress.
Deepak Kamalanathan, 2008
6
Handbook of multilevel
metallization for integrated ...
.
Syd R. Wilson, Clarence J. Tracy, John L. Freeman, 1993
7
Fundamental Studies of Diffusion Barriers for Copper ...
The decreasing device dimensions in microelectronic circuits set high demands for film conformality as the barrier layer thickness is anticipated to decrease to 1.9 nm for the 25 nm node (by 2015).
8
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
3.3 Metallization methods for alumina ceramics Metallization methods for
alumina ceramics using conductive paste can be broadly classified into two types
; thick film processing and cofiring (HTCC). Although both methods share many
points ...
9
Semiconductors, Metal Oxides, and Composites:
Metallization ...
This symposium provided a forum for current work on the electrodeposition and characterization of functional coatings and nanostructures.
G. Oskam, P. M. Vereecken, X. Shao, J. Fransaer, 2010
10
Stress-Induced Phenomena in
Metallization: 11th ...
In addition to experimental studies, modelling and simulation capabilities are demonstrated to evaluate the effect of stress on product performance and reliability. Stress-related phenomena in 3D IC interconnects are covered too.
Ehrenfried Zschech, Paul S. Ho, Shinichi Ogawa, 2010
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Pre-Market News Analysis on: American Capital (NASDAQ:ACAS …
... ALTUS systems deposit conformal atomic layer films for tungsten metallization applications; VECTOR family of plasma-improved chemical ... «wsnewspublishers, 七月 15»
Low-Cost Snap Cure Conductive Adhesive for Stringing Solar …
... withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. «Solar Novus Today, 七月 15»
PVD Systems support processes for MEMS, sensors, and IoT.
MRC Eclipse systems include 100mm to 200mm wafer size capability for front or backside metallization, offer high throughputs, and maintain ... «ThomasNet News, 七月 15»
ECC creating programs for renewable energy jobs
Techniques taught in the nanotechnology program include reactive ion etching, metallization and photolithography. ECC is also creating a ... «WKBW-TV, 七月 15»
OEM Group Develops Suite of Integrated PVD Solutions for MEMS …
MRC Eclipse systems include 100mm to 200mm wafer size capability for front or backside metallization, offer high throughputs, and maintain ... «MarketWatch, 七月 15»
Dr. Angus MacLeod, President and CEO, Thin Film Center
Thin-film solderable coatings and face metallization on wafers from DSI are typically used for hermetic sealing of sensitive packages. These coatings can be ... «Laser Focus world, 七月 15»
yves béhar takes on thermostats with hive 2 for british gas
the industrial design team in san francisco drew from new forms and materials, to create a NCVM (non-conductive vacuum metallization) front ... «Designboom, 七月 15»
Pore-sealing Low-k Dielectrics in Advanced Interconnects
... deposited from vapor phase on 300mm wafers into low-k during chemical vapor or atomic layer deposition and subsequent Cu metallization. «I-Connect007, 七月 15»
Active Stocks Roundup: NetScout Systems, Inc. (NASDAQ:NTCT …
... Family for copper damascene manufacturing; ALTUS systems deposit conformal atomic layer films for tungsten metallization applications. «wsnewspublishers, 七月 15»
LG Solar utilizes ASYS technology
The initial Asys metallization lines at LG were deployed for the production of p-type cells. The most recently delivered lines are used for double ... «evertiq.com, 七月 15»
